DUAL FREQUENCY WIRE BONDER KAIJO FB-910

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The completely automatic FB-910 gold wire bonder has a “Dual Frequency Function”. The bonding process can be performed with frequencies of 150 kHz or 60 kHz to achieve the best possible results on different surfaces and materials. The change between “High Frequency” and “Low Frequency” can be realised in the bonding process without mechanical adjustments.

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Highlights:

  • New high speed recognition system
  • Newley developed low vibration  XY -Table
  • Capable of Gold and Copper wire bonding  (Option)
  • Dual frequency US-Transducer
  • Fine Pad Pitch Capability:  up to 35µm
  • Leadframe size up to 270mm (x) x 90mm (Y)
  • Bonding time: 45msec/Draht
  • Repeatability: ±2,5 µm
  • Bonding area: 56mm x 80mm
  • Wire length: up to 8mm
  • Loop heights: 100µm (Standard Mode); 65µm (FJ Loop)